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Brand Name : Aorun
Model Number : Aorun 1354
Place of Origin : China
MOQ : 450KG
Price : Negotiable
Payment Terms : L/C, D/A, D/P, T/T,, MoneyGram, Western Union
Supply Ability : 100000kg per month
Delivery Time : 5-8 work days
Packaging Details : drums
Product name : Potting Glue
Mixing Ratio : 2:1
Classification : Double Components Adhesives
Type : epoxy
Appearance : light yellow and transparent liquid
Usage : Epoxy floor coatings
Epoxy Resin AB Glue Potting Glue For Electronic Components Surface Encapsulation
Quick Detail:
Name | Epoxy Resin 1354 | Usage | Epoxy floor coatings |
Mixing Ratio | A: B =2:1 (By weight) | Applications | Epoxy floor coatings,Electronic component potting epoxy compound |
silicones systems. Our products feature outstanding electrical insulation properties, superior adhesive strength, thermal conductivity and excellent chemical resistance. Potting and encapsulating compounds provide reliable long term performance for microelectronic, electronic, electrical devices, components including:
Power supplies
Switches
Ignition coils
Electronic modules
Motors
Connectors
Sensors
Cable harness assemblies
Capacitors
Transformers
Rectifiers
Items | Units/conditions | Technical Data |
Viscosity | Shore-D | 80-85 |
Volume resistivity | 25℃/ Ω./ cm | 4.3x1015 |
Surface resistivity | 25℃/ Ω. | 2.6x1014 |
Dielectric strength | 25℃ KV/MM | 25 |
Coefficient of linear expansion | CM/K | <6.1x10-5 |
Glass transition temperature | ℃ | >90 |
Temperature resistant | ℃ | -60~120 |
FAQ:
Q: Can you offer samples?
A: Yes, we offer samples as you requested.
Q: How about the MOQ ?
A: No MOQ for the standard product.
Q: What's the MOQ ?
1600KG
Q: How about the lead time?
A: In General, the lead time will be 2 weeks for normal order quantity. For mass order, it is negotiable.
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Electronic Components Potting Glue Surface Encapsulation Light Yellow Images |